For citations:
Barbin E.S., Kulinich I.V., Nesterenko T.G., Koleda A.N., Shesterikov E.V., Baranov P.F., Il’yaschenko D.P. Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure. Devices and Methods of Measurements. 2024;15(4):323-333. https://doi.org/10.21122/2220-9506-2024-15-4-323-333