Detection of Hidden Defects Induced by Thermomechanical Processing of Aluminum Substrates for Sensor Devices Using a Scanning Kelvin Probe
https://doi.org/10.21122/2220-9506-2025-16-1-47-54
Abstract
The object of the study was aluminum substrates for creating sensor devices based on anodic aluminum oxide, which underwent mechanical processing in the form of grinding and straightening. The subject of the study was the detection of residual mechanical stresses and other surface defects to assess the quality of this processing using the scanning Kelvin probe technique. The technique applied allows for the effective detection of residual plastic deformations of aluminum substrates resulting from their mechanical processing with a resolution sufficient to detect mechanical stresses associated with individual roughnesses.
Supporting agencies: The Work was supported by the Belarusian Republican Foundation for Fundamental Research under Grant No. T23МЭ-045.
About the Authors
A. L Zharin
Belarusian National Technical University
Belarus
Belarus
Nezavisimosty Ave., 65, Minsk 220013
I. V. Gasenkova
SSPA "Optics, Optoelectronics, and Laser Technology"
Belarus
Belarus
Nezavisimosty Ave., 68-1, Minsk 220012
A. K. Tyavlovsky
Belarusian National Technical University
Belarus
Belarus
Address for correspondence:
Tyavlovsky A.K. -
Belarusian National Technical University,
Nezavisimosty Ave., 65,
Minsk 220013, Belarus
e-mail: andrey_psf@tut.by
N. I. Mukhurov
SSPA "Optics, Optoelectronics, and Laser Technology"
Belarus
Belarus
Nezavisimosty Ave., 68-1, Minsk 220012
S. I. Spitski
SSPA "Optics, Optoelectronics, and Laser Technology"
Belarus
Belarus
Nezavisimosty Ave., 68-1, Minsk 220012
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Review
For citations:
Zharin A.L., Gasenkova I.V., Tyavlovsky A.K., Mukhurov N.I., Spitski S.I. Detection of Hidden Defects Induced by Thermomechanical Processing of Aluminum Substrates for Sensor Devices Using a Scanning Kelvin Probe. Devices and Methods of Measurements. 2025;16(1):47-54. https://doi.org/10.21122/2220-9506-2025-16-1-47-54
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