Preview

Control of local stress in semiconductor silicon structures

https://doi.org/10.21122/2220-9506-2018-9-3-254-262

Abstract

Residual stress distribution in multilayer semiconductor structure is complicated and has a significant impact on device characteristics and yield, therefore their study is one of the actual tasks of modern device engineering. Purpose of the present work was to develop methods of estimation of actual residual stress distribution at the whole area of semiconductor structure and its elements as well.

The estimation of residual stress distribution at the area of semiconductor structure was carried out on the basis of determining of local deformation of some areas of the structure by Makyoh topography. This method is based on consequent measurements of intensity of Makyoh image elements of the structure along the chosen direction followed by calculation of micro-geometrical profile and curvature radius.

The estimation of residual stress of topological elements Si–SiO system was carried out by means of calculation of interference pictures obtained in a film-substrate gap after separating of film edge from substrate along open window perimeter.

Analytical expressions relating semiconductor structure image characteristics with their deformation were developed by means of finite elements method. The expressions allow determining of local residual stress of chosen area of the structure. The examples of stress calculations in real structures are given.

Proposed residual stress calculation methods allow to take into consideration character and curvature form of substrate, and also to estimate their magnitude in real topological elements of semiconductor circuits.

About the Authors

S. F. Sianko
Physical-Engineering Institute of the National Academy of sciences
Belarus

Address for correspondence: Sianko S.F. – Physical Technical Institute of the National Academy of sciences of Belarus, Kuprevich str., 10, Minsk 220141, Belarus.     e-mail: senkosf@tut.by

 



V. A. Zelenin
Physical-Engineering Institute of the National Academy of sciences
Belarus


References

1. Yazhunskiy I., Kulinich O., Smyntyna V. Vliyanie okisleniya na defektoobrazovanie v legirovannom kremnii [Influence of oxidation on defects formation in dopped silicon]. Lambert Academic Publishing, 2011, 188 р. (in Russian).

2. Zelenin V.A., Senko S.F. [New methods and control devices in microelectronics]. Tekhnologii Fiztekha. Yubileinyi sbornik trudov. [FTI Technology. Jubilee collection works]. In 2 parts. Part. 1. Under red. academician S.A. Astapchik, Minsk, Ekoperspektiva Publ., 2003, pp. 234–253.

3. Sianko S.F., Sianko A.S., Zelenin V.A. [Quantitative characterization of topographic defects of semiconductor silicon wafers]. Doklady BGUIR, 2018, vol. 115, nо. 5, pp. 12−18 (in Russian).

4. Kasimov F.D., Lyutfalibekova A.E. [Calculation of elastic stresses in heterogeneous semiconductor structures]. Tekhnologiya i konstruirovanie v elektronnoi apparature, 2002, no. 2, pp. 13−14 (in Russian).

5. Ayvazyan G.E. [About the determination of internal stress in the film – substrate system]. Izv. NAN RA I GIUA. Ser. TN, 2000, vol. LIII, no. 1, pp. 63−67 (in Russian).

6. Ayvazyan G.E. Anisotropic Warpage of Wafers with Anodized Porous Silicon Layers. Phys. Stat. Sol. (a), 1999, vol. 175, pp. 7–8.

7. Ullman J., Kellock A.J., Baglin J.E. Reduction of Intrinsic Stress in Cubic Boron Nitride Films. Thin Solid Films, 1999, vol. 341, pp. 238–245.

8. Dyuzhev N.A., Dedkova N.A., Gusev E.E., Novak A.V. [The method of measurement of mechanical stresses in thin films on the plate using an optical profilometer]. Izvestiya vuzov. Elektronika, 2016, no. 4, pp. 367−372 (in Russian).

9. Riesz, F. Geometrical optical model of the image formation in Makyoh (magic-mirror) topography. J. Phys. D: Appl. Phys., 2000, vol. 33, pp. 3033–3040.

10. Riesz F. Makyoh Topography for the Study of Large-Area Extended Defects in Semiconductors. Phys. Stat. Sol. (a), 1999, vol. 171, no. 1, pp. 403–409.


Review

For citations:


Sianko S.F., Zelenin V.A. Control of local stress in semiconductor silicon structures. Devices and Methods of Measurements. 2018;9(3):254-262. (In Russ.) https://doi.org/10.21122/2220-9506-2018-9-3-254-262

Views: 872


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.


ISSN 2220-9506 (Print)
ISSN 2414-0473 (Online)